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PQC Chips & Hardware

Post-quantum cryptography is moving from libraries into silicon. Through 2025-2026 a wave of secure elements, TPMs, secure MCUs, and licensable IP cores arrived with ML-KEM, ML-DSA, SLH-DSA, and the stateful hash schemes XMSS/LMS built into hardware. This page snapshots confirmed chip and IP-core products versus roadmap intent, and flags where side-channel resistance and FIPS 140-3 validation still matter most.

Secure elements & secure MCUs

Vendor / productWhatDate
SEALSQ (WISeKey) QS7001Hardware-embedded PQC secure element on a RISC-V MCU, with ML-KEM + ML-DSA in silicon; targets crypto-wallets against HNDL, aligned to CNSA 2.0Announced 2025-05, volume 2025-11
Samsung S3SSE2ASamsung has announced a PQC secure-element / security-module direction for mobile devices, claiming it will bring capabilities such as ML-KEM into the Galaxy ecosystem; specific part numbers, volume-production scope, and device coverage should be verified against official announcements.2026-01
NXP i.MX 95 / i.MX 94Hybrid ML-DSA+ECDSA signed firmware on i.MX 95; i.MX 94 adds an EdgeLock PQC root-of-trust; NXP+Keysight published ML-DSA side-channel work2025-2026
Microchip MEC175xBEmbedded controllers with in-hardware ML-DSA, LMS verify, and ML-KEM (CNSA 2.0); PQC also offered on PolarFire FPGAs2025-2026
STMicroelectronicsX-CUBE-PQC library and SHA-3 accelerators on STM32/Stellar; new secure-MCU IP targeting CC + FIPS 140-3 for ML-KEM/ML-DSA/XMSS/LMS (partly roadmap)2025-2026

SEALSQ's QS7001 is notable as a general-availability PQC secure element rather than a demo: it puts both a lattice KEM and a lattice signature into a RISC-V part aimed squarely at wallet and IoT identity, where Harvest Now, Decrypt Later (HNDL) exposure is real today. Samsung's S3SSE2A (a vendor claim, with specifics pending official confirmation) points toward PQC reaching consumer handsets, while NXP and Microchip push ML-DSA/LMS verification into firmware-integrity and embedded-control roles, where the device must verify post-quantum signatures even if it rarely generates them.

TPMs & root-of-trust silicon

Vendor / productWhatDate
Infineon OPTIGA TPM SLB 9672First TPM with PQC-protected firmware update (XMSS, 256-bit); certified for NVIDIA Jetson Thor; next-gen OPTIGA to embed ML-KEM/ML-DSA (roadmap)2026-06
Google OpenTitanOpenTitan is advancing a production-grade open-source root-of-trust; its roadmap includes post-quantum secure-boot capability. The specific Chromebook shipping scope, foundry details, and SLH-DSA enablement status should be verified against OpenTitan / Google official announcements.2026-03

Infineon's SLB 9672 uses a stateful hash signature (XMSS) to protect its own firmware updates — a conservative, well-understood choice for long-lived devices, and a good example of why state management for XMSS/LMS is a hardware concern (see xmss-lms.html). OpenTitan is a significant open-source RoT whose roadmap includes a post-quantum (hash-based SLH-DSA) secure-boot chain; its actual rollout scope in volume consumer hardware and enablement status should be verified against official announcements, though it remains a notable transparency milestone.

Licensable IP cores

Vendor / productWhatDate
PQShield PQPlatform-CoPro & PQMicroLib-CoreLattice + hash co-processor IP, plus a sub-5KB-RAM PQC-TLS core shown at Embedded World 20262026
Rambus CryptoManager RT-6xxRoot-of-trust IP with FIPS 203/204/205 plus XMSS/LMS2025-2026
Synopsys Agile PQC PKA + PUFPQC public-key accelerator IP paired with PUF (ex-Intrinsic ID) for key provisioning2025-2026
FortifyIQ FortiPQCSCA/FIA-resistant, OTA-updatable PQC IP2025-10
PQSecure; Crypto Quantique QDID PUF + XipheraHardware PQC cores; PUF-based identity combined with Xiphera PQC engines2025-2026

IP cores let SoC designers add PQC without a full chip respin. The headline trends are tiny footprints (PQShield's PQMicroLib-Core runs PQC TLS in under 5KB of RAM) and built-in side-channel hardening (FortifyIQ's FortiPQC is explicitly SCA/FIA-resistant and field-updatable). Combining a PUF with a PQC engine — as Synopsys and Crypto Quantique do — ties post-quantum keys to a hardware-unique identity. On the open ISA front, RISC-V PQC ISA-extension and RoCC accelerator SoCs were demonstrated at RISC-V Summit Europe 2025, though these remain research prototypes.

China: domestic PQC silicon

Vendor / productWhatDate
国芯科技 (Guoxin) AHC001 (with 信大壹密)PQC automotive MCU that passed combined PQC + AI testing; claimed first domestic PQC+AI automotive chip2025-2026
问天量子 (Anhui) + HUSTFirst chip-level PQC card pairing a PQC SoC with a quantum-RNG chip2025-07
海光 (Hygon)Plans PQC signature support in 2026, with hardware products around 2027 (roadmap)roadmap

China's hardware path mirrors its software one: push PQC down into chips rather than leave it in libraries. Guoxin's AHC001 targets the automotive market, 问天量子's HUST collaboration delivers a chip-level PQC card that bundles post-quantum compute with a quantum random-number generator, and Hygon has stated CPU-level PQC intentions for 2026-2027. For the broader domestic vendor and 密码机 picture, see cn-vendors.html and pqc-hsm.html.

Side-channels & FIPS 140-3

Putting PQC in silicon does not by itself make it safe. Lattice and hash schemes have data-dependent operations — rejection sampling, NTT, decapsulation checks — that can leak through timing, power, or EM on embedded targets. The hardware story is therefore inseparable from masking, fault resistance, and constant-time design; see side-channels.html and the implementation notes in implementations.html. Most of these products advertise FIPS 140-3 (and CC) intent, but combined FIPS 140-3 hardware + PQC validations are largely still in process; treat "certified" claims as scoped to specific modes, algorithm testing, or firmware versions.

Standards & references

Note
Snapshot as of June 2026; vendor claims are their own; FIPS 140-3 hardware+PQC validations are largely still in process.

PQC 芯片与硬件

后量子密码正从软件库走入芯片。2025 至 2026 年间,一批安全芯片、TPM、安全 MCU 以及可授权 IP 核相继落地,把 ML-KEMML-DSASLH-DSA 以及有状态哈希方案 XMSS/LMS 直接做进了硬件。本页梳理已确认的芯片与 IP 核产品,并把它们与仅停留在规划阶段的意向区分开,同时标出侧信道防护与 FIPS 140-3 认证最关键的环节。

安全芯片与安全 MCU

厂商 / 产品能力时间
SEALSQ (WISeKey) QS7001基于 RISC-V MCU 的硬件级 PQC 安全芯片,ML-KEM + ML-DSA 固化在硅片中;面向数字钱包对抗 HNDL,对齐 CNSA 2.02025-05 发布,2025-11 量产
Samsung S3SSE2ASamsung 公布面向移动设备的 PQC 安全芯片/安全模块路线,宣称将把 ML-KEM 等能力引入 Galaxy 生态;具体型号、量产范围和终端覆盖需以官方公告为准。2026-01
NXP i.MX 95 / i.MX 94i.MX 95 采用 ML-DSA+ECDSA 混合签名固件;i.MX 94 引入 EdgeLock PQC 信任根;NXP 与 Keysight 发布 ML-DSA 侧信道研究2025-2026
Microchip MEC175xB嵌入式控制器内置硬件 ML-DSALMS 验签与 ML-KEM(CNSA 2.0);PolarFire FPGA 亦提供 PQC2025-2026
STMicroelectronicsSTM32/Stellar 上的 X-CUBE-PQC 库与 SHA-3 加速器;面向 CC + FIPS 140-3、支持 ML-KEM/ML-DSA/XMSS/LMS 的新一代安全 MCU IP(部分为规划)2025-2026

SEALSQ 的 QS7001 值得关注之处在于它是一款正式量产的 PQC 安全芯片而非演示样片:它把格基 KEM 与格基签名同时放进一颗 RISC-V 器件,直指钱包与物联网身份场景,而这些场景今天就面临真实的先收集、后解密(HNDL)风险。Samsung 的 S3SSE2A(厂商宣称,具体范围待官方公告核实)预示 PQC 走向消费级手机;NXP 与 Microchip 则把 ML-DSA/LMS 验签推向固件完整性与嵌入式控制场景,这类设备即便很少生成签名也必须能验证后量子签名。

TPM 与信任根芯片

厂商 / 产品能力时间
Infineon OPTIGA TPM SLB 9672首款以 PQC 保护固件升级的 TPM(XMSS,256 位);已通过 NVIDIA Jetson Thor 认证;下一代 OPTIGA 将内置 ML-KEM/ML-DSA(规划)2026-06
Google OpenTitanOpenTitan 正在推进量产级开源信任根落地;其路线包含后量子安全启动能力。具体 Chromebook 出货范围、代工信息与 SLH-DSA 启用状态需以 OpenTitan / Google 官方公告核实。2026-03

Infineon 的 SLB 9672 使用有状态哈希签名(XMSS)保护自身固件升级——对长生命周期设备而言这是保守且成熟的选择,也很好地说明了为何 XMSS/LMS状态管理是硬件层面的问题(参见 xmss-lms.html)。OpenTitan 则是一个重要的开源信任根,其路线包含后量子(基于哈希的 SLH-DSA)安全启动链;其在量产消费硬件中的落地范围与启用状态需以官方公告核实,但作为透明化方向仍具标志意义。

可授权 IP 核

厂商 / 产品能力时间
PQShield PQPlatform-CoPro 与 PQMicroLib-Core格基 + 哈希协处理器 IP,以及在 Embedded World 2026 展出的、内存占用低于 5KB 的 PQC-TLS 核2026
Rambus CryptoManager RT-6xx信任根 IP,支持 FIPS 203/204/205 以及 XMSS/LMS2025-2026
Synopsys Agile PQC PKA + PUFPQC 公钥加速 IP,结合 PUF(源自 Intrinsic ID)用于密钥注入2025-2026
FortifyIQ FortiPQC抗 SCA/FIA、可 OTA 升级的 PQC IP2025-10
PQSecure;Crypto Quantique QDID PUF + Xiphera硬件 PQC 核;基于 PUF 的身份与 Xiphera PQC 引擎结合2025-2026

IP 核让 SoC 设计者无需重新流片即可加入 PQC。两大主线趋势是极小占用(PQShield 的 PQMicroLib-Core 在 5KB 内存内跑通 PQC TLS)与内建侧信道防护(FortifyIQ 的 FortiPQC 明确抗 SCA/FIA 且可现场升级)。把 PUF 与 PQC 引擎结合——如 Synopsys 与 Crypto Quantique 所做——可将后量子密钥绑定到硬件唯一身份。在开放指令集方面,RISC-V Summit Europe 2025 展示了 RISC-V PQC ISA 扩展与 RoCC 加速器 SoC,但这些仍属研究原型。

中国国产 PQC 芯片

厂商 / 产品能力时间
国芯科技 AHC001(联合信大壹密)通过 PQC + AI 联合测试的车规 PQC MCU;号称国产首颗 PQC+AI 车规芯片2025-2026
问天量子(安徽)+ 华中科技大学首张芯片级 PQC 密码卡,将 PQC SoC 与量子随机数芯片结合2025-07
海光(Hygon)计划 2026 年支持 PQC 签名,硬件产品约 2027 年面世(规划)规划

中国的硬件路线与其软件路线相呼应:把 PQC 下沉到芯片,而非停留在库层。国芯科技的 AHC001 面向汽车市场;问天量子与华中科技大学的合作交付了一张把后量子计算与量子随机数发生器打包在一起的芯片级 PQC 卡;海光则明确了 2026-2027 年 CPU 级 PQC 的意向。更完整的国产厂商与密码机图景,参见 cn-vendors.htmlpqc-hsm.html

侧信道与 FIPS 140-3

把 PQC 做进硅片本身并不等于安全。格基与哈希方案存在数据相关的运算——拒绝采样、NTT、解封装校验——在嵌入式目标上可能通过时序、功耗或电磁泄露。因此硬件话题与掩码、抗故障注入、常数时间设计密不可分;参见 side-channels.htmlimplementations.html 中的实现要点。这些产品大多宣称面向 FIPS 140-3(及 CC),但 FIPS 140-3 硬件 + PQC 的联合认证大多仍在进行中;对"已认证"说法应理解为仅限特定模式、算法测试或固件版本。

标准与参考

注意
内容为 2026 年 6 月的快照;厂商宣称均由其自身负责;FIPS 140-3 硬件与 PQC 的联合认证大多仍在进行中。
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